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  Samsung has developed a new packaging solution for Display Driver IC (DDI) that helps to dissipate more heat in TV applications demanding high performance and resolution. The new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation and minimizing contact thermal resistance between the DDI and the display panel. The new [...]

  At the forum held in Taiwan, Samsung also unveiled the world’s first chip to embed a capacitive touchscreen control function with mobile display driver IC (DDI). With the integration of capacitive touchscreen function along with the DDI technology, manufacturers can give users the advantages of capacitive, lower power consumption that will effectively increase the [...]