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Samsung creates a 0.6mm thick 32GB memory chip
Samsung has developed the world’s thinnest multi-die memory package that is just 0.6mm thick and packs a whopping 32GB of storage. The new memory package is 40 percent thinner and lighter compared to the conventional memory packages stacked with eight chips. The ultra-thin package consists of eight dies (chips) of 4GB NAND flash that [...]
Samsung Flex-OneNAND memory will get 40nm treatment
Samsung continues its innovations for the Flex-OneNAND fusion memory chip. They will now be using 40nm process technology to produce 8Gb (Gigabit) Flex-OneNAND memory. Flex-OneNAND is a fusion of SLC and MLC NAND in a single silicon chip. With the help of the bundled software, the user can optimize the portion of SLC and [...]
