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Multi-chip package

Samsung to ship Multi-chip package with PRAM for mobile devices

April 28, 2010 By kunal 1 Comment

  Samsung has announced to ship industry’s first Multi-chip package (MCP) with PRAM from this quarter. The PRAM touted as the next successor of NOR flash is apt for use in mobile handsets and the new MCP-based 512Mbit PRAM is said to be backward compatible with 40nm-class NOR flash memory. PRAM uses phase change characteristics […]

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