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More Pictures and specs of AMOLED 3D phone (SCH-W960)

May 5, 2010 By kunal 2 Comments

  New pictures and specifications of Samsung’s first phone with 3D Display has surfaced. The phone is known as AMOLED 3D (SCH-W960) in South Korea and has a dedicated 3D button that shows 3D content without the need of any special glasses. The phone features a 3.2-inch WQVGA AMOLED display, TouchWiz UI 2.0, 3G, 3.2MP […]

Samsung E65 e-book reader gets certified by Wi-Fi Alliance

May 5, 2010 By kunal 2 Comments

  We first got wind of Samsung’s E65 about couple of months back and now the Wi-Fi Alliance has certified the device, confirming it to have Wi-Fi. E65 is more or less similar to Samsung’s first e-book reader, E60 but integrates a full QWERTY keyboard instead of the sliding form factor. E65 will sport a […]

Rumor: Samsung S-Pad tablet PC will have 7-inch Super AMOLED screen and run Android OS

May 4, 2010 By kunal 12 Comments

  More details have surfaced of Samsung’s upcoming tablet computer. Although Samsung executive confirmed to launch the tablet in the second half of 2010, Electronic Times is reporting an August release in addition to other details. According to the newspaper, Samsung began working on the ‘S-Project’ tablet early this year and is now rumored to […]

Samsung’s smartphone portfolio will consist of 50% Android and 33% bada

May 4, 2010 By kunal 5 Comments

  One Samsung executive recently confirmed about the platform structure for upcoming Samsung smartphones. According to him, Samsung’s smartphone portfolio will have 50 percent of Android devices while its own bada platform will account for about 33 percent phones. They haven’t confirmed the status of Windows Mobile or LiMo but the Microsoft OS should understandably […]

Samsung develops u-LTCOF for Display Driver IC with high heat dissipation

May 3, 2010 By kunal 1 Comment

  Samsung has developed a new packaging solution for Display Driver IC (DDI) that helps to dissipate more heat in TV applications demanding high performance and resolution. The new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation and minimizing contact thermal resistance between the DDI and the display panel. The new […]

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