Samsung is at Gamescom, and they have unveiled the P9 and the P7 portable SSDs featuring USB4 support. The chic and professional-looking P Series targets users who store a lot of ultra-high-resolution and AI content as well as large games. The P9 is the world’s first 8TB USB4 portable SSD that boasts sequential read speeds […]
Hardware
Samsung Mass Produces PCIe 6.0 SSD Built for AI Workloads
Samsung has announced the mass production of the PM1763, its PCIe 6.0-based enterprise SSD built for next-generation AI and HPC server environments. The drive is aimed at handling the rising data demands of AI training and inference workloads. It succeeds the PM1753 in Samsung’s enterprise SSD lineup. The PM1763 uses Samsung’s 9th-generation V-NAND alongside a […]
Samsung Unveils Industry’s Fastest UFS 5.0 Storage for On-Device AI
Samsung has unveiled the industry’s fastest UFS 5.0 storage solution, designed for next-generation on-device AI applications. The new standard integrates the latest embedded memory interface specification from JEDEC and reaches a bandwidth of up to 10.8 gigabytes per second (GB/s). The solution delivers a sequential read speed of up to 10.8 GB/s and a sequential […]
Google Eyes Samsung’s 2nm Process for ‘Icefish’ TPU
Google is reportedly in talks with Samsung to manufacture a component of its next-generation AI processor using Samsung’s 2-nanometer production technology, according to a report by The Information. The chip in question, codenamed “Icefish,” is a tensor processing unit (TPU) co-designed with MediaTek, with TSMC expected to handle the main computing portion while Samsung may […]
Samsung Unveils HBM5 Architecture at Computex 2026 with New In-Package Thermal Design
Samsung has unveiled the first physical mockup of its eighth-generation high-bandwidth memory, HBM5, at the ongoing Computex 2026 in Taipei. The display, held within the Samsung Display booth, paired the next-generation AI memory with a new in-package thermal structure called Heat Path Block, or HPB. HPB addresses heat buildup at the die-to-die interface — the […]