Samsung has developed a new packaging solution for Display Driver IC (DDI) that helps to dissipate more heat in TV applications demanding high performance and resolution. The new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation and minimizing contact thermal resistance between the DDI and the display panel.
The new u-LTCOF package is an innovative solution considering both the package technology and the module structure for outstanding heat dissipation. We expect the u-LTCOF solution to be applicable to other semiconductor chips such as D-TV system-on-chips (SoCs) that require high-speed processing of increased data.
The first Low Temperature Chip On Film (LTCOF) from Samsung was introduced in 2007 that used a thin-film metal tape to spread the heat and helped to improve up to 30 percent heat emission over normal Chip On Film (COF). With the advent of u-LTCOF and use of viscoelastic silicone, Samsung claims it dissipates 20 percent more heat as compared to the LTCOF package. Furthermore, viscoelastic silicone does not require additional thermal pads or metal film that helps to reduce cost.
The u-LTCOF package is designed for DDIs in 240Hz Full HD, 3D LED TVs and other large-sized PDP and LCD TVs.
The planned production of the u-LTCOF is expected to begin from the end of this year.
Hi, I am trying to order or find the part number for ultra Low Temperature Chip On Film for a Samsung un65ru8000fxza version aa02, any assistance would be greatly appreciated. Thank you for your time.