Samsung today confirmed that they’ve added 11nm FinFET process technology to its foundry process portfolio. The 11LLP (low power plus) offers 15 percent better performance and is 10 percent smaller in size with same power consumption when compared to a chip based on 14nm.
Samsung says the new process is expected to be ready by the first half of next year and will cater to mid- and high-end devices. The current 10nm FinFET will still be targeted towards premium handsets whereas 7nm LPP with EUV (extreme ultra violet) lithography technology is planned for second half of 2018.
Samsung will share more details on its foundry portfolio at Samsung Foundry Forum Japan on September 15 in Tokyo.
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