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Samsung confirms Snapdragon 820 uses their new 14nm process

January 14, 2016 By anish Leave a Comment

Exynos 8 Octa 8890

Samsung today confirmed to have begun the mass production of its second-generation 14nm FinFET process. However, the announcement also carries a confirmation that Qualcomm’s upcoming Snapdragon 820 processors will be based on Samsung’s latest 14nm process. The new process takes advantage of Low-Power Plus (LPP) that results in improvements in performance and at the same […]

Samsung announces Portable SSD T3 with up to 2TB storage

January 5, 2016 By Siddhanth Leave a Comment

Samsung Portable SSD T3

Samsung’s pocket-sized external portable SSD has got an upgrade this year. Announced at the CES, the Portable SSD T3 now offers up to 2TB of storage, doubling it from last year’s Portable SSD T1. The new external drive features Samsung’s proprietary Vertical NAND (V-NAND) and SSD TurboWrite technology that helps to copy/read 4K data with […]

Samsung mass produces smart bio-processor

December 29, 2015 By Siddhanth Leave a Comment

Samsung Bio-Processor

Wearable devices will soon be able to take advantage of Samsung’s new bio-processor that has gone into mass production. Samsung’s bio-processor is touted as an all-in-one health solution chip that integrates Analog Front Ends (AFE), but also microcontroller unit (MCU), power management integrated circuit (PMIC), digital signal processor (DSP), and eFlash memory. This means Samsung’s […]

Samsung unveils 128GB PRO Plus microSD cards

December 16, 2015 By Siddhanth Leave a Comment

If you’re looking for some extra storage for your high-end smartphone or camera, Samsung today announced a 128GB microSD card under its PRO Plus range. Built on Samsung’s MLC NAND flash solution, the company says it’s a perfect fit for high-end devices with 4K recording and playback feature. The 128GB PRO Plus card is the […]

Samsung starts production of 128GB DDR4 RAMs

November 26, 2015 By Siddhanth Leave a Comment

Samsung today confirmed that they’ve started mass production of its 128GB DDR4 RAM modules. Targeted at servers and data centers, the modules are industry’s first “through silicon via” (TSV) DDR4 128GB memory modules. The 128GB TSV DDR4 RDIMM comprises of 144 DDR4 chips, each containing four 20-nanometer (nm)-based 8-gigabit (Gb) chips assembled with TSV packaging […]

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