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Hardware

Samsung unveils 256GB UFS 2.0 storage for mobile devices

February 29, 2016 By Siddhanth Leave a Comment

256GB UFS 2.0 memory

Samsung has expanded its embedded memory lineup with the new 256GB memory option. The new memory is targeted at high-end mobile devices and is based on the fast Universal Flash Storage (UFS) 2.0 standard. Faster than a SATA-based SSD for PC, the new UFS memory offers duplex data transfer and has a sequential read speed […]

14nm Exynos 7 Octa 7870 targets mid-range devices

February 16, 2016 By Siddhanth Leave a Comment

Exynos 7 Octa 7870

Samsung’s 14nm processor were exclusive to their high-end devices but it seems, Samsung reckons it’s the right time to trickle the 14nm-process goodness to mid-range devices. Samsung today announced the arrival of Exynos 7 Octa 7870 that is targeted specifically at mid-range and other mobile devices and are processed using Samsung’s latest 14nm FinFET process […]

Samsung confirms Snapdragon 820 uses their new 14nm process

January 14, 2016 By anish Leave a Comment

Exynos 8 Octa 8890

Samsung today confirmed to have begun the mass production of its second-generation 14nm FinFET process. However, the announcement also carries a confirmation that Qualcomm’s upcoming Snapdragon 820 processors will be based on Samsung’s latest 14nm process. The new process takes advantage of Low-Power Plus (LPP) that results in improvements in performance and at the same […]

Samsung announces Portable SSD T3 with up to 2TB storage

January 5, 2016 By Siddhanth Leave a Comment

Samsung Portable SSD T3

Samsung’s pocket-sized external portable SSD has got an upgrade this year. Announced at the CES, the Portable SSD T3 now offers up to 2TB of storage, doubling it from last year’s Portable SSD T1. The new external drive features Samsung’s proprietary Vertical NAND (V-NAND) and SSD TurboWrite technology that helps to copy/read 4K data with […]

Samsung starts production of 128GB DDR4 RAMs

November 26, 2015 By Siddhanth Leave a Comment

Samsung today confirmed that they’ve started mass production of its 128GB DDR4 RAM modules. Targeted at servers and data centers, the modules are industry’s first “through silicon via” (TSV) DDR4 128GB memory modules. The 128GB TSV DDR4 RDIMM comprises of 144 DDR4 chips, each containing four 20-nanometer (nm)-based 8-gigabit (Gb) chips assembled with TSV packaging […]

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