In addition to 3-bit MLC NAND chips, Samsung also started mass producing 32Gb MLC NAND memory supporting asynchronous DDR interface and have already shipped the first batch to major OEMs. NAND flash is used in SSDs, SD cards, PMPs etc. and with the adoption of asynchronous DDR NAND, it can greatly improve the performance, […]
Tech
Samsung mass produces 30nm 3-bit MLC NAND chips
Samsung has initiated volume production of industry’s first 3-bit multi-level-cell ( MLC) NAND flash chips using the 30nm process. The chips using the new process and 3-bit technology allows the NAND data storage to increase its efficiency by over 50 percent as compared to a 2-bit NAND chip. This 30nm 3-bit tech will be […]
Samsung creates a 0.6mm thick 32GB memory chip
Samsung has developed the world’s thinnest multi-die memory package that is just 0.6mm thick and packs a whopping 32GB of storage. The new memory package is 40 percent thinner and lighter compared to the conventional memory packages stacked with eight chips. The ultra-thin package consists of eight dies (chips) of 4GB NAND flash that […]
Samsung shows off 10.1-inch color e-paper
Amongst the different displays at the FPD 2009, Samsung is also showing a color e-paper that will hopefully be seen in the future e-book readers. The 10.1-inch 0.7mm thick color e-paper was made by combining the E-Ink’s e-paper, a glass TFT substrate and color filter and features a resolution of 450×600, contrast ratio of […]
Curved Display, 3D Display for mobiles, transparent AMOLED and more
Check out these displays that are currently being showcased at the FPD 2009. Intrinsic details regarding each of the displays are hard to find so suffice yourself with pictures for now. 3.3-inch AMOLED WQVGA screen with 3D 3.5-inch WVGA Curved Display 2-inch AMOLED transparent display supporting 176×220 resolution, 16.7M colors and having a 30 percent […]