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Samsung develops 8 and 12MP imaging sensor with Backside Illumination (BSI)

February 10, 2011 By kunal 2 Comments

  Samsung has developed two imaging sensors for smartphones and other high-end devices that will offer superior low-light performance. The S5K3H2 8 megapixel CMOS imager features Samsung’s advanced 1.4 micron (um) back side illuminated (BSI) pixel technology that will enable users to shoot better quality pictures in low-light conditions. The new imager is touted to […]

Samsung to offer refunds on PCs using faulty Intel chipset

February 1, 2011 By kunal Leave a Comment

  Samsung has announced that consumers using computers with Intel’s faulty support chip are eligible to get a full refund or an exchange of the product. There are six PC lineups using the faulty chipset in South Korea whereas one in United States. The cost of the refund will be borne by Intel. On January […]

Samsung to showcase 3D LED monitor with Asymmetrical design at CES

January 5, 2011 By kunal 2 Comments

  Samsung has confirmed that they’ll show their new SyncMater 9 Series 3D LED Monitor at the CES in a couple of days. The SyncMaster TA950’s uniqueness comes with its asymmetrical and curved design. Samsung says such design gives the monitor a distinctive look coupled with their own Touch of Color design. The technical details […]

Samsung samples MLC-based SSD for enterprise-class storage

December 21, 2010 By kunal Leave a Comment

  Samsung has announced that they’ve developed multi-level-cell (MLC)-based Solid State Drives for enterprise storage applications. Coming in capacities of 100, 200 and 400GB options, the SSDs are apt for servers as the new SSD provides higher-density while consuming very less power. The SSD uses 30nm-class MLC NAND flash chips that support Toggle DDR and […]

Samsung develops 8GB DDR3 DRAM using 3D chip stacking technology

December 7, 2010 By kunal Leave a Comment

  As part of Samsung’s Green DDR3 range, Samsung has announced the development of an 8GB RDIMM memory module using three-dimensional (3D) chip stacking technology which is also referred to as ‘through silicon via’ (TSV). Samsung says major customers have successfully tested the 3D-TSV module that helps to save up to 40 percent of power […]

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