Samsung today announced that its subsidiary, Samsung Foundry is now qualified to develop chips using 32nm low power (LP) high-k metal gate (HKMG) process technology. The process has been successfully tested at Samsung Foundry’s 300-millimeter logic fabrication line, the S Line, in South Korea and is ready for production. As part of the process, […]
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Samsung at SID 2010
In addition to showing the world’s largest 19-inch transparent AMOLED screen, Samsung is showcasing a number of display technologies at the Society of Information Display (SID) 2010. Samsung is exhibiting its 3D panel lineup that will include a 240Hz 3D LED TV panel, a 52-inch 3D Digital Information Display that does not need any […]
Samsung shows off 19-inch transparent AMOLED at SID 2010
Samsung was happily flaunting a 14-inch transparent AMOLED laptop at the CES early this year and now Samsung Mobile Display, the display manufacturing subsidiary is showing off a 19-inch transparent AMOLED screen at the SID 2010. This makes the world’s largest transparent AMOLED but that is not all. Samsung says the screen’s transparency is […]
Samsung develops u-LTCOF for Display Driver IC with high heat dissipation
Samsung has developed a new packaging solution for Display Driver IC (DDI) that helps to dissipate more heat in TV applications demanding high performance and resolution. The new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation and minimizing contact thermal resistance between the DDI and the display panel. The new […]
Samsung to ship Multi-chip package with PRAM for mobile devices
Samsung has announced to ship industry’s first Multi-chip package (MCP) with PRAM from this quarter. The PRAM touted as the next successor of NOR flash is apt for use in mobile handsets and the new MCP-based 512Mbit PRAM is said to be backward compatible with 40nm-class NOR flash memory. PRAM uses phase change characteristics […]