Samsung has developed a new packaging solution for Display Driver IC (DDI) that helps to dissipate more heat in TV applications demanding high performance and resolution. The new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation and minimizing contact thermal resistance between the DDI and the display panel. The new […]
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Samsung to ship Multi-chip package with PRAM for mobile devices
Samsung has announced to ship industry’s first Multi-chip package (MCP) with PRAM from this quarter. The PRAM touted as the next successor of NOR flash is apt for use in mobile handsets and the new MCP-based 512Mbit PRAM is said to be backward compatible with 40nm-class NOR flash memory. PRAM uses phase change characteristics […]
Samsung creates 20nm NAND Flash for use in memory cards
Samsung has announced the industry’s first 20nm-based NAND flash chips aimed to use in SD memory cards and embedded memory solutions. Samsung says memory cards based on this process tech give faster write and read speeds. Samsung had created 30nm-based NAND flash a year before and today these 20nm MLC NAND touts to give […]
Samsung develops 2MP image sensor with full HD support
Samsung has developed 2.1MP and 1.3MP CMOS image sensors that will bring high-definition support to webcams and cameras requiring video capture. The 1.3MP (S5K6A1) and 2.1MP (S5K5B3) image sensors are specifically created to accommodate in thin LCD notebook panels without compromising on the capture quality. The imagers boast improved low-light sensitivity of 70Lux while […]
Samsung video shows difference between AMOLED and Super AMOLED screens
Super AMOLED is the next generation of AMOLED screen. Although it may sound more of a marketing gimmick it does have some advantages which is rightly pointed by this small Samsung video. Unlike touchscreen LCDs or AMOLEDs, Super AMOLEDs have touch sensor directly placed on the screen that helps it to make thinner and […]