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SoC

Samsung starts mass production of SoC based on 10nm FinFET process

October 17, 2016 By Siddhanth Leave a Comment

Samsung logo

Samsung has announced the mass production of its upcoming System-on-chip (SoC) based on 10nm FinFET fabrication process (10LPE). This mass production will make Samsung the first company in the industry to do so that uses an advanced 3D transistor structure with additional enhancements in both process technology and design enablement to do so. Compared to […]

14nm Exynos 7 Octa 7870 targets mid-range devices

February 16, 2016 By Siddhanth Leave a Comment

Exynos 7 Octa 7870

Samsung’s 14nm processor were exclusive to their high-end devices but it seems, Samsung reckons it’s the right time to trickle the 14nm-process goodness to mid-range devices. Samsung today announced the arrival of Exynos 7 Octa 7870 that is targeted specifically at mid-range and other mobile devices and are processed using Samsung’s latest 14nm FinFET process […]

Samsung to mass produce Exynos 5250 SoC in Q2 2012, will be integrated in smartphones as well

January 27, 2012 By kunal 2 Comments

  Not a surprise really but it’s always good to hear from the horse’s mouth. During today’s earnings call, Samsung confirmed that they’re sampling the Exynos 5250 SoC and will begin mass production from second quarter of this year. Samsung’s executive also said that the initial target will be to integrate this dual-core processor into […]

Samsung Exynos 4210's 3D prowess shown off at GDC

March 4, 2011 By kunal 2 Comments

  Samsung’s latest dual-core SoC Exynos 4210 (Orion) was shown off at the ARM booth at Games Developers Conference. The video shot by Engadget shows Samsung’s Mali-400 graphics equipped SoC easily delivering 1080p content at 60fps in 3D. However, ARM’s exec also said the chip is capable to do stereoscopic 3D at 70fps but is […]

Samsung develops u-LTCOF for Display Driver IC with high heat dissipation

May 3, 2010 By kunal 1 Comment

  Samsung has developed a new packaging solution for Display Driver IC (DDI) that helps to dissipate more heat in TV applications demanding high performance and resolution. The new ultra Low Temperature Chip On Film (u-LTCOF) packaging solution enhances heat dissipation and minimizing contact thermal resistance between the DDI and the display panel. The new […]

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