Samsung has unveiled the first physical mockup of its eighth-generation high-bandwidth memory, HBM5, at the ongoing Computex 2026 in Taipei. The display, held within the Samsung Display booth, paired the next-generation AI memory with a new in-package thermal structure called Heat Path Block, or HPB. HPB addresses heat buildup at the die-to-die interface — the […]
Hardware
Samsung Achieves 900-Layer V-NAND Milestone
Samsung has successfully built a pre-production 900-layer-class V-NAND chip, making the Korean giant the first company in the world to reach this milestone. According to a report by ETNews, Samsung used its Cell Multi Bonding (CMB) technology to bond two 450-layer cell wafers into a single integrated system. A core component in AI servers, smartphones, […]
Samsung Introduces microSD Express Card for Nintendo Switch 2
Samsung has introduced its first line of microSD Express cards, targeting the new P9 Express series as a high-speed storage solution with faster data transfer aimed at Nintendo Switch 2 users. Available in 256GB and 512GB capacities, the P9 Express is the first microSD product from Samsung to use the PCIe interface and NVMe protocol […]
9100 PRO Series is Samsung’s PCIe 5.0 SSDs
Samsung today announced its new line of PCIe 5.0 M.2 SSDs only to yank the page after some time. Nevertheless, we have the full information of Samsung’s speedy SSDs. The 9100 PRO series is targeted towards gamers, content creators and AI-related tasks, and offers a sequential read and write speed of 14,800 MB/s and 13,400 […]
Samsung gets Nvidia’s approval to supply 8-layer HBM3E Memory
Nvidia has approved Samsung’s HBM3E RAM, according to a report by Bloomberg. The approval came in December but it is limited to the 8-layer HBM3E memory as opposed to the 12-layer HBM3E, which is used with the faster chips. These less advanced RAMs will be customized for the Chinese AI market, however, both Samsung and […]